Semiconductor, MEMS

Intraratio’s solutions are equipped with Automated Serialized Unit Traceability to the die level, for complete genealogy, including material and component supplier source.

Wafer Map Data Capture single and multi-device (MPW) wafer map data capture, storage and translation for downstream assembly and test operations, including Chip-on-Wafer assembly.

Assembly and Test Data Capture storage, and translation: die singulation, chip-on-wafer assembly, PCBA die-attach, and test.